Chip123 科技應用創新平台

標題: ISE的問題...請教前輩們 [打印本頁]
作者: mclaren_18    時間: 2007-8-9 11:25 AM
標題: ISE的問題...請教前輩們
   如題:* X8 C/ W) ?; z/ _
各位大大們:
3 w2 D  F! h; D  s& p' ?請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
+ u  a, E- M+ `6 G- r  Y; _我的IOB超出範圍出現以下錯誤..該如何解決啊??; e- p1 E0 l  h5 g# _) I' s
! X4 `8 o1 H; c8 h, O$ ^8 y
ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.9 g! ?2 x3 y3 i/ x2 [2 n  `
  e: Z) h! j" M+ I
ERROR:Map:115 - The design is too large to fit the device.  Please check the6 p; D1 U0 f6 e4 ~4 ?% v7 @
   Design Summary section to see which resource requirement for your design/ |; y0 O6 Y; E; N0 V3 f) J
   exceeds the resources available in the device.  In particular check the& V9 f6 J4 j0 Q$ z' C; G+ M
   non-slice resources since the slice counts may reflect the early termination) D  `1 ]2 T7 J; [* W
   of the flow.
5 T/ H' |* K% @& Z1 i$ K7 {
+ V) i; f0 q" @   NOTE:  An NCD file will still be generated to allow you to examine the mapped
" C6 D. F( W# G4 R% r2 {   design.  This file is intended for evaluation use only, and will not process
( k, G0 }, c1 L! p/ g   successfully through PAR.) @; G; m- @2 \

, X8 J9 j3 _1 L  V+ w- oERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
7 s$ y: l  a  t  E. w
; {- @+ W! ]# v9 L2 @謝謝      
作者: ssejack1    時間: 2007-8-9 01:42 PM
Device 的 IO block 只有  440  但 design 須 563 !超出了!
# U" E, [* n) x( q. G換較大的 package or 減少 IO 使用數量!



歡迎光臨 Chip123 科技應用創新平台 (http://www.chip123.com.tw/) Powered by Discuz! X3.2