|
Duties and Responsibilities
z3 C Y' g! e; q+ M9 q6 E$ c2 X$ L: y* T9 ^
1. Responsible for PKG NPI Process Set-up (including cost reduction, new material development and new process development) in the area of Solder die attach (soft solder die attach, paste solder die attach, epoxy die attach), Reflow soldering and cleaning, Heavy Al wire bond (5-20 mils wire) , Au wire bond and Cu wire bond. 5 L" R; k0 Y" @
2. Responsible for process characterization and improve process capability based on 6sigma process capability.
3 A+ h" Y' l8 w7 |( F3. Responsible for co-work and hands over to process engineering on process set-up results according to APQP procedure based 6sigma process capability. 9 _& L1 ]; a+ ^/ V9 ~
4. Responsible new process equipment selection and evaluation to communicate with equipment engineering with right comparison of COO t, B* a$ X T& v, ^7 B N8 R
5. Benchmarking one new process and new Process Development that does not exist and outside design Rule by Co-work with Dev. Engineer and process engineers 6 Z. x6 }4 N9 T% U9 m
6. Conduct PA work following Advanced Product Qualification Plan (APQP) Spec, FSC-QAR-0013.
/ O. ?% o& a; t. ^# }: D q7 K7. Responsible for deliberative package development, Major Tool Change (Mold die etc) to improve quality and In-sourcing project that is new
3 x4 x2 x. P% h* V8 O' g$ }1 j9 t8. Holding technical leadership for process development working with project members such like Industrial Engineering, SCM, Purchasing, Process Engineering, QA, Program management, Human resource, Facility, and manufacturing. 5 f7 p8 F& n, Q& W
9. Study and understand customer requirements, application, EHS and design those things to the process development.
# p! N/ l' C- K6 I10. Supporting development engineers to generate and create documents deliverables such as control plan, process FMEA, LAR plan, project charter, Quality function development, project schedule, line certification plan, to identify process development cost, etc. & ^# f% [2 C( F# {; P& D' O
11. To plan and execute process optimization, failure analysis, process characterization, samples build for the development. 0 F- w* K. h/ g: |/ j/ ^
12. To lead project team members related with process development.
5 x6 U/ Z( | i0 {0 A. J2 |4 k13. To find technical and systematic solution for failures of reliability, quality, manufacturability, cost, and cycle time that are related with process. 14. Track team member performance and report to origination manager / S L" G/ L$ J6 j+ k
15. To share and update project progress, risk of delay, constraints, weekly at designated day with stakeholders, project team, sponsors. |
|