ISE的問題...請教前輩們

mclaren_18

   如題:
各位大大們:
請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
7 ^7 W% o; O' [/ }8 M8 H% v我的IOB超出範圍出現以下錯誤..該如何解決啊??

5 I: Q# X" V/ b) g* AERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

6 I9 ]+ Q+ z3 x6 JERROR:Map:115 - The design is too large to fit the device.  Please check the
6 Q  R+ d8 s2 C" t) ]   Design Summary section to see which resource requirement for your design
3 y  @' A' X2 @1 y- ~: O; p4 Q& G   exceeds the resources available in the device.  In particular check the
   non-slice resources since the slice counts may reflect the early termination
, s$ z# K- z, A; u9 W   of the flow.

   NOTE:  An NCD file will still be generated to allow you to examine the mapped
5 r5 a& ~# p) O3 }2 @   design.  This file is intended for evaluation use only, and will not process
   successfully through PAR.
0 d' O- H/ \3 Z
ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
換較大的 package or 減少 IO 使用數量!