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Mechanical Design Engineer7 \1 Y1 V2 b: X1 u8 S
( y# D, W" Y7 o" q6 V" P4 z公 司:A US semiconductor equipment company
5 y* ]+ E* o4 _- y5 r' ], G9 t工作地点:苏州
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- P7 Z; z" g4 _6 ]职位描述; n0 i1 N1 H1 c: j
Mechanical design for power electronic units and sub assemblies (converter, inverter, cooler…) for hybrid / electronic vehicles and non-automotive products. 7 Z: f1 q0 |9 L( F
2D, 3D Designing (ProE) according to pre-defined technical requirements, holding time line and quality;
; t: R: J* M7 w& b! _( F/ TProduct responsibility of power electronic units and sub assemblies (converter, inverter, cooler, housing…) 0 q7 j+ F Q, h0 O
Design coordination with internal and external departments (MD, Hardware, Layout etc.)
1 f" Z3 E+ ?* _* z' W V% QCollaboration with international suppliers
9 I& X+ L9 Q* O* i x+ e* gWorking according to product engineering in simultaneous engineering team from concept phase to series production
1 v! y, B7 F6 d. Y( tResponsible for regular design reviews in the SE team. ! g5 r) P5 S5 f
Responsible of choosing appropriate assembly and interconnection technologies and manufacturing processes
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职位要求
0 f& o$ g, _5 h1 P- ?Requirements:
5 S& B; p6 w1 Z1 e' w* _& d7 {Education: Completed master study or higher in Mechanical Engineer, Design Engineer, Plastic Engineer
, n' \0 H6 x* T( V( I) |& mWorking Experience : have experience in high power electronic design or similar area for 2 or more years
$ b V* S: f+ q* X! SKnowledge in working acc. to product engineering - e- `3 u Z7 U2 w I
Knowledge/Skills:"Fundamental know how regarding die casting process and materials, bending stamping and forging processes and materials, high power interconnection. Basic knowledge of plastic engineering. Experience in working with ProE and PDMLink.
. g8 M, q S+ q \; O( dknowledge in DRBFM L3 or higher |
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