ISE的問題...請教前輩們

mclaren_18

   如題:
* H9 t: h0 @% y1 w: J各位大大們:
請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
我的IOB超出範圍出現以下錯誤..該如何解決啊??

. g& H# F4 m. YERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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ERROR:Map:115 - The design is too large to fit the device.  Please check the
& V$ ~, A& E+ U. r) A& n$ \! W3 d   Design Summary section to see which resource requirement for your design
2 E# C1 R4 M0 o( q" t! t   exceeds the resources available in the device.  In particular check the
   non-slice resources since the slice counts may reflect the early termination
& ^3 u. b+ \+ Z   of the flow.
$ U* T9 O* ^  ]
9 W7 [* ^, Z7 Q- t" ], F1 b3 J% h   NOTE:  An NCD file will still be generated to allow you to examine the mapped
9 I  O( Y  w, B! J   design.  This file is intended for evaluation use only, and will not process
   successfully through PAR.
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3 a  q: P1 d: ~4 m4 [3 IERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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! V+ [0 O" T1 l& q3 v6 ]( {謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
8 o' Y7 l# h2 T, D換較大的 package or 減少 IO 使用數量!