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發表於 2010-6-25 08:50:33
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Abstract -- The diode operated in forward-biased condition has
) j; v! x; z* t! Y& @been widely used as an effective on-chip ESD protection device at
9 O1 ^8 Y7 P9 Q, _% _ IGHz RF and high-speed I/O pads due to the small parasitic
$ c# ?; C2 t6 X' U" yloading effect and high ESD robustness in CMOS integrated
$ J% P) n$ {, T8 P* I2 |3 U! Tcircuits (ICs). This work presents new ESD protection diodes
1 g5 U6 k) |' r1 t3 Arealized in the octagon, waffle-hollow, and octagon-hollow layout
7 {+ b0 I. e1 m" X: istyles to improve the efficiency of ESD current distribution and
( O. d5 i1 O2 q6 f0 Z; z7 Z3 Ito reduce the parasitic capacitance. The new ESD protection) \ T- i5 {/ \" Y, z/ O' m5 P3 [
diodes can achieve smaller parasitic capacitance under the same. ~+ ]" V6 |( E4 K/ c! T' d
ESD robustness level as compared to the waffle diode. Therefore,
9 _) j' x; R+ P2 N* e6 q0 }the signal degradation of GHz RF and high-speed transmission9 }: Y! O, x; ?) n+ F* Z
can be reduced due to smaller parasitic capacitance from the new
* W( T' _/ u% n! Eproposed diodes. |
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