Chip integrates baseband, multimedia processing and radio

jacky002

Chip integrates baseband, multimedia processing and radio
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! {% n/ m6 p$ H: E  E1 A) v  N% t% wBy Gina Roos
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Courtesy of eeProductCenter
(02/15/2008 10:23 H EST)

    San Diego, Calif. — Qualcomm Inc. has introduced a new single-chip solution that brings multimedia and broadband capabilities to mass-market handsets. The Qualcomm Single Chip (QSC) QSC6295 integrates baseband, multimedia processing and radio functionality into a single chip, touting cost- and time-to-market advantages to help drive wireless broadband and 3G adoption in mass markets.

2 b/ _! N# @/ c9 A    The QSC6295, which leverages advanced 45-nanometer CMOS process technology, combines multimedia features, power-saving innovations and broadband data speeds to redefine the capabilities of next-generation mainstream handsets, said the company. The single-chip solution offers a combination of advanced modem capabilities, including HSPA and HSPA+, and rich multimedia features to deliver a next-generation mobile user experience on mass-market handsets.

9 M" m8 I: W- m6 p8 g9 J1 N& L: H  m    Key features include:

        * 400 MHz ARM 11
* W" d4 w' ?( u) o: Y        * Support for WQVGA video playback and recording with TV-out
& U5 e, v; s; v5 C- i$ K* f        * 5.0 megapixel camera
        * 3D hardware-accelerated graphics
        * Integrated gpsOne baseband and radio
$ y( ?5 t8 A3 M0 B        * Integrated Bluetooth baseband and radio, FM radio and USB 2.0 HS
2 o" `( z8 w6 r: ~; q( }/ {        * Support for all UMTS bands and quad-band EGPRS, as well as receive diversity for enhanced data throughput performance
% V3 k! F. C* u: O        * 12 x 12-mm package
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3 H0 c6 a1 n3 h& D0 }, I$ U    The QSC6295 also integrates several features of the UMTS Rel. 7 standard (HSPA+) to deliver increased battery life, as well as a more instant experience with reduced lag.

) y) M6 r+ `5 `    Availability: The QSC6295 is scheduled to sample in the first quarter of 2009.
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    Qualcomm Inc., www.qualcomm.com
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& j) I+ y/ _/ ^! C" x/ D) TSource: http://www.rfdesignline.com/showArticle.jhtml?articleID=206504545

jacky002

請問各位先進，如果要將MAC + BaseBand + RF整合在一起，其難度有多高?
( {) q9 C8 E1 C/ J最近在想一個問題，就是未來的Wireless BroadBand市場，會不會是以NPU + MAC/BaseBand + RF + Switch/PHYs整合在一起的解決方案? 那這樣豈不是一統天下?
0 n$ c. m5 i% [到底這樣的SOC其優勢和劣勢會是如何呢?
9 O0 U2 ]7 q/ j& v我先提出看法:
  優勢(Pros): Cost down與高整合度的解決方案
  劣勢(Cons): Power consumption極高，整合技術難度高與Yield Rate低
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+ n, S  X2 A0 {% E+ ^- ?2 D8 r$ U不曉得各位有何看法呢?