ISE的問題...請教前輩們

mclaren_18

   如題:
各位大大們:
( ^8 r# t: Y) e& F$ Z8 l請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
我的IOB超出範圍出現以下錯誤..該如何解決啊??

! _4 c/ F* e: k! QERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

ERROR:Map:115 - The design is too large to fit the device.  Please check the
2 l6 `+ P8 q& I' H2 F1 G; S- ~( J   Design Summary section to see which resource requirement for your design
, ~& X) m7 X  e' T   exceeds the resources available in the device.  In particular check the
) n7 F. i: s# ~0 F2 O7 h   non-slice resources since the slice counts may reflect the early termination
/ `! a% R+ c6 ?" p9 b% _" D- _5 F   of the flow.
3 `4 a* Q# M$ h' I7 b. q8 V: Q& c
: Z2 X& h- s+ c$ `8 z. U& Z   NOTE:  An NCD file will still be generated to allow you to examine the mapped
5 |9 S5 s, X6 K! ^; `$ Y, w: o1 ]   design.  This file is intended for evaluation use only, and will not process
8 h6 p3 v6 A: G% P5 z$ T, w   successfully through PAR.
4 g4 }" {/ J# u' Z) I; o3 C
ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
8 r4 y. y- m) o" _8 F換較大的 package or 減少 IO 使用數量!