Time | Description |
Opening - Vision of Collaborative Alliance |
08:30 - 09:00 | Registration |
09:00 - 09:05 | Opening Remarks : e4 g2 [+ c; q$ @+ l! V3 W
I. Representative of MOEA * j/ y$ @$ p! S6 U( n: H5 s
II. Chairman of Association of East Asian Relations |
09:05 - 09:10 |
09:10 - 09:30 | Message from ITRI
5 I ]* W4 A% s8 hDr. Cheng-Wen Wu
! E+ F# {, {. x7 f1 S- h6 i) bGeneral Director of STC |
09:30 - 10:00 | Keynote Address I
. Y0 l; c5 Q3 r. ~# ]) P: ^ xChung-Hua Institution for Economic Research, CIER |
10:00 - 10:30 | Keynote Address II
, _; m! z& p: D; y* |! XProf. Mitsumasa Koyanagi 4 H' _& A& v3 b2 m$ u" O- X
Chief Commissioner , 3DIC 2008 Organizing Committee |
10:30 - 10:50 | Break |
Session 1 - 3D IC (Manufacturing) Hosted by Jing-Jou Tong , Executive Assistant, STC, ITRI |
10:50 - 11:20 | Topic: Challenges of 3D IC
; ^$ i0 W. j: S+ m: BMr. Tjandra Winata Karta - C4 p4 S6 V) Y) @+ o. M
Senior Director , tsmc |
11:20 - 12:00 | Renesas SiP Future Technology
! S3 G& D' Y4 Y6 AMr. Masashi Umino% ?. C: r/ s' y; t
Group Manager , RENESAS |
12:00 - 13:20 | Lunch |
13:20 - 13:50 | Emerging 3D-Memory Device : J+ x: \1 B; j$ D
Prof. Ken Takeuchi
. v* b7 W, n0 Q G9 L. A; w: ^6 iThe University Of Tokyo |
Session 2 - 3D IC (Packaging) Hosted by Wei-Chung Lo, Director , EOL, ITRI |
13:50 - 14:20 | Topic: TBC
" Q ]- ], h- I1 k! D1 ~Prof. Hajime Tomokage ( s- i9 W+ b2 b8 M$ J
Fukuoka University |
14:20 - 14:50 | 3D Packaging Overview
6 E0 Q8 `4 o e0 e* F, BDr. Ho Ming Tong
4 }* r6 I3 ]! P9 ^- l7 T. c6 lChief R&D Officer, ASE Group |
14:50 - 15:20 | Emerging business on Silicon interposer BGA package, success or fail? . t' l- t% | T3 W9 S/ W
Mr. Naoya Tohyama
G% F6 s+ Q3 u9 M9 t7 yLiquid Design Systems, Inc |
15:20 - 15:50 | CMOS sensor and logic wafer level package
- t6 Z" X) F" G' gMr. Wei Ming Chen
$ c0 k9 o6 b/ g& D, u$ TR&D Vice President , Xintec Inc |
15:50 - 16:10 | Break |
16:10 - 16:50 | Topic: TBC
; B1 \0 A/ I& g s5 vMr. Takeo Minomiya $ f% z B/ h! \' y
Board Chairman , TSUNAMI Network Partners Corp. |
16:50 - 17:20 | Panel Discussion |
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