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Which verification elements does your team use on your current design project?

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1#
發表於 2013-9-3 15:37:35 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
Pls check all that apply, unless you don’t know?
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2#
發表於 2013-10-22 15:35:35 | 只看該作者
Staff Hardware Based Design and Verification Engineering Lead
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公      司:One world top EDA company
# K8 y# e' U, ~- w& D工作地点:上海/ k$ ]! `0 Q/ P, G. R

) P( m5 b% C. K1 H2 ^Position Description:  7 S  Z! ~" Q6 J
1. The Staff Hardware Verification Engineering Lead will be in charge of a team of field engineers to support advanced hardware based verification flow integration engagements with Cadence customers and provide easy-to-adopt packages and workshops to xx  field application engineers and customers alike. $ m5 k4 Y& Y& v7 V8 F. N" w% t" w

3 Z/ y% j# f# `3 b  f: O0 D) L2. He/she will focus on the technical aspects of the following hardware verification solutions for customer engagements as well as creating demos/workshops to train field AE and customers: % U9 n: s7 Y7 o6 r+ w2 j7 P
(1) xx  Palladium HW Acceleration Platforms $ q5 u/ r1 w7 g$ V
(2) xx Acceleratable Verification IP portfolio
( j0 S3 I' ~- f: j* @# W& L: J5 X) c% i(3) CVA product integration with other xx products such as Incisive Simulation and RTL Compiler for power analysis4 m- M- Q. t  R1 {5 _
(4) HW/SW Co-verification solutions for SoC designs
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3#
發表於 2013-10-22 15:35:41 | 只看該作者
Position Requirements:  6 l+ ^" K  s* e- d; h
1. Experience:  
8 L  s3 s0 \; X, ^/ @4 S; s. q- Minimum experience required: 10 years  1 U; ~/ J7 F# d8 `
- Expertise in RTL top-down design and verification methodology automation are required. This includes full hands on knowledge of writing and debugging Verilog, VHDL and SystemVerilog based D&V environments.
; |  y; S6 \& R2 l: u- We would also like the candidate to have good knowledge of SoC design principles, embedded software development and HW/SW codesign and coverification.1 K; O' O# `# y) l+ C) f( H9 y; J( c
- Knowledge of UNIX, C/C++, other scripting programming languages ( Perl, TCL…) is highly desired
4 A* p# w7 A/ I0 i1 j6 g- Strong verbal and written communication skills in English are required  ( u& y& x! B! m+ C5 }9 T
- HW acceleration or In-Circuit Emulation or FPGA prototyping experience is a must / h* [: t8 G$ [% g
- Hardware verification, including knowledge of HDL simulators and debugging simulations 6 ~  U! J  B  G3 i) u
- Hands on experience with using design and verification languages like SystemC, SystemVerilog (IEEE 1800) and VHDL is a must." j6 F2 y7 I. [9 T0 C5 b! s0 U
- Knowledge of embedded systems and software development for SoCs is a plus * Z4 Q% b4 ?. O5 G, A5 d; z
2. Education:  & q. ~/ l5 `5 q) R
Ideally the person should possess the BS/BE level of understanding of CS or EE Engineering concepts  
- I. }  }( X  g7 ?( Z# ?3 g" O- Minimum Education Required: education level of BS with 10+ years experience (or MS with 7+ or more years experience).
; b' w: ?/ {9 }) J6 U1 G, i3. Travel of 30% of the time should be expected.
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4#
 樓主| 發表於 2013-12-12 09:14:21 | 只看該作者
Senior Physical Design Engineer! L) w3 e- f/ w4 R* \0 F/ x
公      司:A famous IC company
! Y" h/ n1 \6 R4 i0 ?" z. h7 `工作地点:南京$ e4 l" |' ^: m, D1 u  t- [
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Key Responsibilities  5 ^; O  ?. y: ^9 |0 n
Depending on experience, key responsibilities will involve some of the following:  + N, ^( {( ?' t
IC implementation from netlist to gdsii, with synthesis, floorplanning, place and route, timing closure, and physical verification.
! f$ U2 ^% X" j4 x' uAs a key member of physical design team, your will work on one of most advanced and the most complex chip designed.
6 X" ]: ^, y8 w& A4 V' L( E* OLeading a team of physical design engineers and resolving the technical related issues.    s# i' M/ b% m2 Y% {' M
Crosstalk analysis, power analysis, and static timing analysis.  
' U$ u3 _0 v( b$ J- R6 s, uWrite scripts in Tcl to improve productivity.  
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职位要求0 v3 r$ }; L5 U* \+ S: M0 m
Experience: 5+ years in physical implementation engineering    ) P# [' B1 Z% Z2 n
Essential skills  3 c/ S9 Z1 ]- a+ q
MS in EE required.&#8226roven track records of working independently on place-and-route project running and DRC/LVS/ERC/Antenna debugging skills  4 ?5 g  s. C1 s; r+ t$ m
Experience with Magma or Synopsys place-and-route tool set and physical design project implementation.  ( S3 e1 t8 J; n
Good programming skill. Capable of writing Tcl or Perl.  % `' H6 g) Z( b, @9 V3 H+ [
Familiar with synthesis, static timing analysis.  
; M& {7 v4 w0 Q! }* e" Q: K8 z4 jSelf-motivated team worker, good verbal and written communication skills in English.  
5 y4 N% C) B) k; T' L9 ~4 ~, B& `Technical and team leadership proffered. Previous management experience highly desired.  
# ?5 O6 ~6 d  d0 zExperience with synthesis, DFT, and verification is preferred.
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5#
發表於 2014-9-29 13:57:16 | 只看該作者
Mentor Graphics 與 TSMC 合作為10奈米推出 IC 設計和結束基礎架構 & r$ \% g3 X( N" E: W
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俄勒岡州威爾遜維爾2014年9月27日電 /美通社/ -- Mentor Graphics Corp.(納斯達克:MENT)今天宣佈該公司與 TSMC(臺灣積體電路製造股份有限公司,簡稱台積電)達成10奈米(nm) 的合作協定。為滿足用於早期客戶的測試晶片和IP(互聯網協議)設計起動的10奈米鰭式場效電晶體 (Fin Field-Effect Transistor;FinFET) 的工藝要求,已經改進了物理設計、分析、驗證和優化工具。基礎架構包括 Olympus-SoC™ 數位設計系統, Analog FastSPICE (AFS™) 平臺(含AFS Mega)和 Calibre® 結束解決方案 ( Calibre® signoff solution )。 2 v  Y2 [8 Z2 _) r
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TSMC 設計基礎架構行銷部 (Design Infrastructure Marketing Division) 高級總監 Suk Lee 表示:「TSMC 和 Mentor正在進行廣泛的工程工作,以便讓雙方的客戶都能很好地利用先進的工藝技術。每一個節點都需要進行許多創新才能滿足新的物理要求、提高客戶設計賦能 (design enablement) 的精確度,與此同時性能更優、轉回時間更短。」
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6 a( F- }; [' {- p+ tCalibre 提供佈線形狀的全色彩能力,以幫助設計者指定符合10奈米規則要求的設計艙(cockpit)之外的色彩分配。針對制定積體電路佈線圖,改進後的Calibre RealTime 產品能進行互動的色彩檢查,同時利用晶片廠認可的Calibre結束平臺能使用所有制定佈線工具進行設計。
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6#
發表於 2014-9-29 13:57:22 | 只看該作者
針對10奈米  FinFET 設計,Mentor 和 TSMC 還改進了Calibre 填充解決方案。Calibre YieldEnhancer 中 SmartFill ECO 的功能支援「隨時填充 (fill-as-you-go)」工作流,以確保IP和其它設計模組在設計過程中都能準確地呈現。當部分設計被修改時,SmartFill ECO功能可重新填充僅僅受影響的那部分,從而最小化轉回時間 (turnaround time)。同樣的,為在諸如TSMC10奈米這樣的先進工藝節點上維持設計層級實現高效的佈線後模擬, Calibre LVS 也被改進了。
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& c2 B6 R4 `: N( w" C8 Y9 D兩家公司還聯手調整了 Mentor® Olympus-SoC 的佈線和路由系統讓它能滿足 TSMC 的10奈米 FinFET 的要求。為了能用於10奈米 FinFET,數據庫、佈線、時鐘樹合成、提取、優化和路由引擎都做了重大的改進。
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為了確保10奈米 FinFET 設備的準確的電路類比,Mentor 與 TSMC 合作讓 BSIM-CMG(伯克利共多柵極電晶體)和 TMI 模型在 Analog FastSPICE 平臺(如AFS Mega)上能用於高速設備和電路層模擬。Calibre xACT™ 提取產品和 Calibre nmLVS™ 產品也支援新的10奈米 FinFET 模型。 1 z0 S4 ^! g' {# G- z2 r

# G" t6 x) G8 K因Mentor 和 TSMC在設計賦能方面的合作讓客戶取得成功的案例,將於9月30日在San Jose Convention Center(聖若澤會展中心)舉行的TSMC的開放創新平臺生態系統論壇(Open Innovation Platform Ecosystem Forum)會議上講述。瞭解詳情,請參訪TSMC網站 www.tsmc.com
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