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標題: ISE的問題...請教前輩們 [打印本頁]
作者: mclaren_18    時間: 2007-8-9 11:25 AM
標題: ISE的問題...請教前輩們
   如題:$ K( h7 d) \0 v, |
各位大大們:0 l6 r( d; Q/ T
請教一下  Number of bonded IOBs:                563  out of    440   127% (*) 7 \5 |- w$ N" {! Z6 M
我的IOB超出範圍出現以下錯誤..該如何解決啊??$ S8 \6 ]1 b+ K" k+ i
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ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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, |' z; [# R" U1 x) }ERROR:Map:115 - The design is too large to fit the device.  Please check the: d9 {8 }( `7 m! r) ]: z' A% R; Q6 v
   Design Summary section to see which resource requirement for your design
6 o0 Y7 E* |. w( z) w& |   exceeds the resources available in the device.  In particular check the
8 B1 f" f8 Q# O" Y8 t   non-slice resources since the slice counts may reflect the early termination" @9 s3 R% m/ J% Q8 |" B8 x
   of the flow.8 j; }, x9 }* Y2 D/ I. {
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   NOTE:  An NCD file will still be generated to allow you to examine the mapped
1 o: {4 K3 W6 ]# j, S5 T   design.  This file is intended for evaluation use only, and will not process6 |) Q; @  f2 \% ^$ j. F# j0 y+ t
   successfully through PAR.1 f; f" f) w: g& E, ], q& D% u
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ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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謝謝      
作者: ssejack1    時間: 2007-8-9 01:42 PM
Device 的 IO block 只有  440  但 design 須 563 !超出了!
4 z! o, f# |( R5 {" H7 v換較大的 package or 減少 IO 使用數量!



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