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[經驗交流] ASIC設計工程師如何保住飯碗?

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41#
發表於 2014-6-12 10:46:55 | 只看該作者
Junior Physical Design Engineer# D9 K. V3 E9 o2 \" r

9 A" t( k8 z' K3 f+ _* \- B1 z公      司: famous IC company: L- h; X3 s  h; l. B* u
工作地点:北京
( d+ T. G8 @) ]' o
  w  i, J  D& [+ M( A& S- P; l! FPosition Tasks, Duties and Responsibilities
$ F( {$ V, A% u. }! x9 BThe ASIC Physical Design Engineer will:
4 m* U$ _' T. S        Complete third party IP integration and ensure vendor guidelines are followed.
, E$ ]$ a& E; C# }; j        Responsible for physical verification (DRC/LVS). 9 V, H6 q& [' O# A# l. ]( r' u' z2 O
        IO ring design, fullchip floorplan. 9 T* j* J7 S0 u, ~! \- m9 n7 B) b% R
        Block level implementation. % C3 c  x# B+ ~, K
        Work with front-end engineers to resolve problems and achieve design closure. . [3 `/ y* |) q: p) q* _' W

- C/ U5 y: [1 Y7 [! TCandidate Qualifications: 4 Y6 [9 z5 k4 Y) z/ a; p2 v4 C' w. H
Candidate must: & P. _" \' j8 g0 f, L) e
        Hold BSEE (MS preferred). ! `1 J( i0 q8 n( n) N  u' q
        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification " x1 `4 H. L5 Q2 G7 }; E) G
        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC.
9 i$ y0 i/ J# T" |" e+ g! K        Have the ability to independently identify and resolve design, tool, and flow problems.
& N. _3 F- c2 i# R' Q5 B        Have related timing and physical concept.
+ L& P+ a; ^9 m7 P        Be able to design and implement physical design strategies and methodologies for deep submicron designs.
4 C! T  f6 I$ j3 y/ h( I% A- \) J        Familiar with EDA tools. : f+ V! z  {  o: u9 b+ x# z
        Familiar with Linux environments.  
. F9 X2 r1 ]" p
: D' d9 F9 p9 m& v! z2 qAny of the following is beneficial:
/ b9 o+ c( @) [- y8 ?$ h4 @2 m        STA constraint design ) E4 L  |  w" y6 E
       Equivalence checking ?RTL to gates, and gates to gates.
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42#
發表於 2014-6-19 09:41:01 | 只看該作者
Junior Physical Design Engineer
- A0 b; [" V2 E; D- h: d
  m: f, U8 E: H8 s$ u公      司:A famous IC company
; w) y9 g2 \) y6 h/ R- L8 o1 k工作地点:北京
3 |3 I+ F$ ^# _2 N' q" r  ]- m+ n! l) y1 ^! _, t. {
Position Tasks, Duties and Responsibilities   J1 v; Z/ k; }( c0 Y% a
The ASIC Physical Design Engineer will:
+ z( E# R1 v5 S4 ^3 ]" s6 h        Complete third party IP integration and ensure vendor guidelines are followed.
0 R: _- O* @& N( R& r        Responsible for physical verification (DRC/LVS). 2 ?7 ]) L" _6 i4 t, o
        IO ring design, fullchip floorplan. / L; e- E( o+ U
        Block level implementation.
9 _: A5 U  R1 g' U( v6 l- K* c" e        Work with front-end engineers to resolve problems and achieve design closure.
/ R  c# p6 n& G/ `  D9 Q! K7 i7 ?: e% F
Candidate Qualifications:
. C  _% k2 q4 ^+ \  ?. ECandidate must:
. y5 c' h7 z/ Y4 Q        Hold BSEE (MS preferred). 8 k  p3 s: s7 e- u3 [" v
        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification ) S. [; d1 T- G) p" `
        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC. - v, z! X' @7 W! T$ s
        Have the ability to independently identify and resolve design, tool, and flow problems.
! G% |; r4 R2 s) O+ v        Have related timing and physical concept. 0 q/ `7 a  E4 V, x' B. h/ W
        Be able to design and implement physical design strategies and methodologies for deep submicron designs.8 s* ?! z! K4 _( }
        Familiar with EDA tools.
( d+ f! F3 f! U; b+ r( l1 E/ }. u  v        Familiar with Linux environments.  / }% H& V4 ]8 d, c- Z( C

* f- ?* h  W+ E# X9 G4 u( GAny of the following is beneficial: 2 a0 g$ N. ]6 B0 x& E1 R
        STA constraint design
5 v6 [7 M/ g( U) h/ K  M$ i1 _( Q       Equivalence checking ?RTL to gates, and gates to gates.
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43#
發表於 2014-6-19 09:42:41 | 只看該作者
Sr. ASIC Design Engineer (encoder/decoder)
! ^4 x# x! h* h! }4 m! W; [* b9 j5 c& w8 P! z
公      司:a leading developer of advanced digital imaging solution
. D4 Q( D+ |, I5 L# u/ c! X工作地点:上海
) C6 T. E$ b' X
- k1 C3 d/ z; ~7 `/ o" C! Q+ A* kPosition Overview: The candidate will join a team of  highly competent ASIC designers involved in design, verification, and implementation (ASIC) of advanced platform for XX''s future generation multi-media products.   
4 D6 O8 ^  B+ _6 t. k
8 ^7 D$ a9 I6 B$ M+ y( P% h主要职责 (70%) : C4 n. \1 f0 [
In-depth knowledge of TV encoder and decoder design. Good understanding of TV system design.  
( |* g/ I8 ?6 o+ Y$ w: A$ q9 ~4 PProficiency on digital filter algorithms and hardware implementation. 3 i- j8 O, m$ b1 e% I0 E# S) F
Development and verification of complex IP module, integration of the IP module into the Soc devices, top-level design handling, system level testing.   c/ J. |! a# y' O- d5 o
Participate in the FPGA platform development and lab debugging   ' k  t* ?* P8 U

& N9 b3 @# g/ I. C1 A% i其他职责 (30%)
4 O& s8 a- u$ V% XParticipate in block level architecture design Assisting embedded FW development.
0 l9 b: C2 e2 ]1 g+ a1 s- I: X职位要求
% Z6 i& s1 C' E1 J' U6 n9 ?( G岗位资格 0 u! g/ o9 o, U/ }) e0 M$ }
经验/技能
1 b" w& o, ?& q& h8 M1. Strong knowledge of TV technologies, knowledge of image signal process and CCTV system is a plus
5 J3 Y6 b' k- J2. Strong knowledge of ASIC design flow. Can define Micro-architecture of the IP module and /or sub-blocks. And able to write detailed engineering specifications. , A& s2 W$ ]1 Q$ I% L3 w+ Q+ k
3. Good communication skills, especially in technical writing and reporting;
5 h- P9 Q/ N, Y3 f! H4. Self-motivated and ability to excel in a team environment.   
; H% j  C6 m( N! A1 |1 p5 q
  o7 R) @2 u; p& J/ ]) B. S教育 2 ~& _1 }) [2 _
MSEE/CE with 3+ years of industry experience
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44#
發表於 2014-6-20 09:03:13 | 只看該作者
Senior Digital Design Engineer
: C$ p6 Q' C( C& u( _9 a' n" a3 Y! \5 k) c& ]0 u- t
公      司:A leading semiconductor company' o& h3 o# f: k  F6 U% s
工作地点:香港2 Z& ^; _3 a9 n" I) u+ S) Z6 n4 Z
) N* K- O4 D8 a  M! e+ {, j3 B
Job Responsibilities:
  k' B; P2 ^1 s" m( q/ g    Perform logic design, RTL coding, design verification, logic synthesis, DFT and static timing analysis 2 H$ V4 g& z7 m5 H1 \- b' d+ B
    Develop verification environment and coverage closure 5 f$ P/ ]' l8 ?! n& Q
    Support wafer level testing and silicon evaluation 4 b' T# m0 C' [2 ]2 k0 a4 w' a$ ~& z
    Prepare technical documents
# W4 q: }1 X. O6 T9 b' `1 b5 W; M* B3 O8 H
Job Requirements:
' h; M: C  y: ~3 ^; H1 M& i/ @1 y    B.Sc or above in Electronic Engineering or equivalent. Applicants with postgraduate degree would be considered as an advantage
7 m7 \  Q2 ?4 Q& `) B    5 Years or above of solid experience in one or more of the following areas: Verilog-based logic design and synthesis, constrained random    testbench with System Verilog & UVM, assertion based design verification or circuit-level SPICE simulations
: }; U1 Z8 Y5 ]# Z5 X    Knowledge of SoC and embedded system. - t/ L+ c3 Z, R4 X, K
    Knowledge of scripting languages such as Perl, TCL and Make $ o) X' F) p3 k" E5 T; u" x1 M# O
    Candidate with less experience will be considered as Digital Design Engineer
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45#
發表於 2014-6-24 11:57:06 | 只看該作者
Junior Physical Design Engineer
% Y; z1 \9 }( r! T; l. H/ t$ s公      司:A famous IC company
* A, }3 R; R, d7 X& n/ s- R工作地点:北京
; t" y+ ]/ o; K" U2 j+ H3 k- l" q; }8 M5 I. a; v
Position Tasks, Duties and Responsibilities
5 Z3 B/ u" i, n: e1 GThe ASIC Physical Design Engineer will: 8 K% W9 {; ?( `# [$ h; a- W
        Complete third party IP integration and ensure vendor guidelines are followed.
2 s, K; q7 f7 ]. |5 F        Responsible for physical verification (DRC/LVS). 6 z: g# m5 W, j; R+ }; k
        IO ring design, fullchip floorplan.
  ]" \) h! C& l) T2 ~6 t        Block level implementation.
! ~. w+ s1 `  z3 s  t        Work with front-end engineers to resolve problems and achieve design closure. ' ]: R! r% Z( r1 J2 Z

$ v% u, w) l* g2 b+ ]) e: u0 ]; q2 MCandidate Qualifications:
) ^5 Y# s6 Q3 t( m4 C9 j+ d0 zCandidate must: 8 q- m# S4 G9 R4 ^
        Hold BSEE (MS preferred). : v, H5 C2 |6 \1 G  Y/ \( b
        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification : G7 O% x7 A% I1 J$ ?
        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC.
5 t; T; U' D5 a- r+ L        Have the ability to independently identify and resolve design, tool, and flow problems.
$ Z5 U# X4 ?8 F" h        Have related timing and physical concept.
& l# r# l( l8 j$ h" l        Be able to design and implement physical design strategies and methodologies for deep submicron designs.
7 ?% u8 o, ]* s  D4 t+ }& s) G        Familiar with EDA tools. - R( H( X7 p4 E0 B
        Familiar with Linux environments.  6 @6 b+ L3 O* ~9 Z6 {1 W7 {
; |3 ~; b1 B/ t9 ]$ P- Z" P
Any of the following is beneficial:
% Z7 A" f. g* v, _" Y  b6 h        STA constraint design $ H2 s' [& G% g! U) `
       Equivalence checking ?RTL to gates, and gates to gates.
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46#
發表於 2014-7-31 12:31:20 | 只看該作者
数字芯片设计工程师(DFT/综合)3 p9 t! E/ R5 G+ `0 k7 k
% `  [" I6 y$ J, _, ^
公      司:A mobile chipset semiconductor company0 ?7 F5 Z" A1 S0 i7 T2 e
工作地点:上海- ?- F" S4 L- W& V1 e
0 k' W' b5 ]+ t( Y4 }5 T7 F0 |
职位描述:
# X4 Z2 l4 q* T9 h1、To provide and support SYN&DFT work for several projects in parallel  
$ O9 b( Q  g# J" L$ X4 I6 o. o2、Run block level implementation for each project, include synthesis, DFT and LEC 1 q$ L+ D" }0 h' t& `* z5 V$ y
3、Support block level physical evaluation  
% V& B+ C  A; }2 f/ S" i/ [4、co-work with designer and provide block level SDC file
+ _0 d4 c4 G( P  t* a) K5、co-work with Back-end team for timing signoff' [; ?& c0 P' O! m9 c3 R
5 g' A3 F+ i* ~* Y* j+ A
职位需求:
4 l8 q5 j3 |" c( [1. 了解集成电路设计的基本流程 ( t+ d; @6 L7 L' h' W' @
2. 相关Synthesis, formal check 和DFT的工作经验。(3A, 3B, 3C精通一项即可)
7 g; M  d. F/ _, X/ w+ p3A. 有超过2~3个项目的synthesis 经验, 用过RTL compiler且熟悉timing的相关知识  
& d  b2 C8 j# F# p8 W3 J# B1 Q% [3B. 有超过2~3个项目的formal check经验,熟悉CPF的low power flow
" }7 D# Y8 z  f0 y% \. }% M3C. 有超过2~3个项目的DFT insertion经验, 用过Mentor DFT的优先考虑 % {- e) |. t! `- ^: |  k; H" S2 h
3. 具有良好的英语阅读和书写能力。
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47#
發表於 2014-10-29 08:13:11 | 只看該作者

ASIC Corporation將展示節能、高頻寬效率的C-RAN解決方案

西班牙巴賽隆納--(美國商業資訊)--eASIC Corporation:: G( [# J# V& Z) M0 }# f8 D$ u# I
: P  n/ P  N/ v' S' f
人物:( ?( X( d% P) r
/ _1 G# E* h5 R6 X2 Z4 z1 V
領先的單光罩自適應ASIC設備供應商eASIC Corporation將由eASIC無線業務主管Christian Lanzani博士擔任代表,負責整體無線策略,包括無線存取、去程傳輸(fronthaul)連線、基頻處理和回程傳輸解決方案。
% M) U% ~" o5 V7 N6 [- c' G, F# K3 J! a( D/ `( Y( ~3 G
事件:
) |* t2 |  G; [" l( r! ?4 T2 b/ _
2 Z* A: L3 V. |# BeASIC將作為聯合贊助商參加Wi-Fi世界高峰會、去程傳輸暨C-RAN高峰會(Wi-Fi World Summit & Fronthaul & C-RAN Summit),展示C-RAN去程傳輸在部署方面的挑戰,提供eASIC解決方案的細節。展示過程將包括無線存取、CPRI over OTN轉換器和基頻集區,包括L1硬體加速的使用案例。
* ~% S' I. u; C
" i" M8 a9 \* C$ }) h8 Y/ V6 n/ {時間:2014年10月29日,週三
/ N! L0 V' L5 ]1 b- e+ ~地點:西班牙巴賽隆納赫斯珀裡亞塔樓酒店(Hesperia Tower Hotel) 7 Q; w0 ~3 B& ?/ c, L
/ g, j/ f4 _8 S' A- }5 R. ~
如需瞭解有關eASIC Corporation的更多資訊,請造訪www.easic.com。Wi-Fi世界高峰會、去程傳輸暨C-RAN高峰會細節可以從以下網址獲得:http://wifiworldsummit.com/8 w: k) l" R* G3 o

+ h  r, q. E  L2 B9 S5 {; b: f關於eASIC1 T) W0 R; S1 r+ F1 g

) U9 \+ _9 D# Y+ G% ieASIC是一家無晶圓廠半導體公司,提供突破性的單光罩自適應ASIC設備,旨在顯著降低客製化半導體設備的整體成本和縮短投產時間。使用通孔層客製路由的專利技術實現了低成本、高性能和快速周轉ASIC及單晶片系統設計。這種創新構造使eASIC能夠提供前期成本顯著低於傳統ASIC的新一代ASIC。eASIC Corporation是一家私人公司,總部位於加州聖塔克拉拉。投資人包括Khosla Ventures、Kleiner Perkins Caufield and Byers (KPCB)、Crescendo Ventures、希捷(Seagate Technology, NASDAQ:STX)和Evergreen Partners。如需eASIC的更多資訊,請造訪www.easic.com
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48#
發表於 2015-2-23 20:44:05 | 只看該作者
Asic 的利基市場和 Fpga的利基市場 各有千秋.1 I) X, N% S' e% K0 Z
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49#
發表於 2015-7-23 21:32:34 | 只看該作者
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