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Layout Guidelines for Optimized ESD Protection Diodes
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1 [4 _; n& ^. k5 F, Y/ ^" YKaran Bhatia and Elyse Rosenbaum
+ A* O" o" P5 n" H6 z. W/ oDepartment of Electrical and Computer Engineering • University of Illinois at Urbana-Champaign
# u, z) P2 l- Y0 c) Q1308 W. Main St., Urbana, IL 61801 • Tel. +1-217-244-0578 • Fax +1-217-244-1946 • Email: ksbhatia@uiuc.edu7 ?; {; E3 ]6 f0 T1 y( W. t& M5 p
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Abstract - In this work, various layout options for ESD diodes’ PN junction geometry and metal routing are
7 y, F$ X E0 X# E5 U" |0 Binvestigated. The current compression point (ICP) is introduced to define the maximum current handling" V& n, q5 D* H: P* |
capability of ESD protection devices. The figures-of-merit ICP/C and RON*C are used to compare the. Z3 o; D# Q9 i9 ?! V- H. Z+ y
performance of the structures investigated herein. |
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