|
2#
樓主 |
發表於 2010-6-25 08:50:33
|
只看該作者
Abstract -- The diode operated in forward-biased condition has( Z* \- Z8 F+ ]
been widely used as an effective on-chip ESD protection device at, t+ P0 X, ?) n/ }0 x, l( F4 f
GHz RF and high-speed I/O pads due to the small parasitic
" `3 C: J) ~- j/ O* F: _loading effect and high ESD robustness in CMOS integrated
& s) D6 k0 V( O, |1 mcircuits (ICs). This work presents new ESD protection diodes
" W0 r: Y. R: S) O: O K+ s; `realized in the octagon, waffle-hollow, and octagon-hollow layout
+ p8 ]( c/ U% D; a7 W4 }; Nstyles to improve the efficiency of ESD current distribution and. |4 {+ Y6 y. [; q( E4 @2 h
to reduce the parasitic capacitance. The new ESD protection
h+ a* k& x1 j- ?& ]7 mdiodes can achieve smaller parasitic capacitance under the same8 e$ D1 [7 P; ?: s
ESD robustness level as compared to the waffle diode. Therefore,; g; z' H* |- K0 N2 t) B* f1 R
the signal degradation of GHz RF and high-speed transmission
: R$ b1 _ d+ e% P; N# V( Ican be reduced due to smaller parasitic capacitance from the new) i) k! _1 E3 ]0 a0 |$ ^* p
proposed diodes. |
|