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GSA Announces 3D IC Working Group Chair- a/ B7 K( @' f$ R4 x8 ~
Cadence Executive Ken Potts to lead GSA 3D IC Working Group & e, ]6 g- D, N3 y$ y8 |, X P( l
: k! ^; L% Q/ G% ISAN JOSE, Calif. (June XX21, 2012) – The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, today announced the appointment of Ken Potts, group director of marketing, Strategic Planning, Cadence Design Systems, as the 3D IC Working Group Chairman. Cadence, a leading global electronic design automation (EDA) company, is a GSA member company.
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- P8 f+ m5 ~0 n% {6 hPotts assumed the role of the 3D IC working group chair after their April 26 meeting where the group planned its strategic directions for 2012 and beyond. More than 50 members attended. This group, in existence for more than three years, has provided the GSA membership and the semiconductor industry an evangelic approach to increased awareness of 3D IC benefits. In the days ahead, the working group will focus less on the educational aspects of this technology and more on its implementation.
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The 3D IC Working Group allows companies spanning the 3D IC ecosystem to meet in a non-competitive forum to tackle and resolve issues that hinder the adoption and commercialization of 3D IC technology and products. The working group will focus on 3D IC business model development, test related activities, and design and manufacturing challenges to full-scale implementation of 3D IC technology. The group will also continue to be an educational facilitator and knowledge repository. |
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