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For ESD test (HBM)
! i1 t7 T, s$ p: gThe following are the test combination:
( G8 p! ]8 p+ g6 a1. Power to Power
/ s+ s6 H* M3 |, n1 i r" V2. Power to Ground3 n3 o0 n$ c/ {* b# p
3. IO to Power
4 M- x5 k" |& p/ w; |. `4. Io to Ground2 s/ d& y m9 k$ l, r2 S. Y
5. IO to IO% [* g% n4 B7 x* J
(different power domain need to be treated as different power. For ground usually you can treat as one group_silicon use substrate as common ground. But if you measure two different ground pin/ball > 2ohms. It should be seperated as 2 grond.)5 h+ w' u% X6 f4 k3 I; A. @4 |" ^
3 P- c' g: b( r" ~the total zap time fomula will be~ 2(+/- polarity) X (IO#X(P#+G#)+IO#+P#X(P#-1)X(P#-2)X...X1+P#XG)" r+ O8 ~, e6 j3 c/ u$ e+ ]
For example: You have IO1/IO2/IO3/P1/P2/G1) R- Q3 J! [& Y! [' i6 q
2x((3X(2+1)+3+2X1+2X1)=25(multiple the zap interval)2 s: [8 z4 }, [: L
So for high pin count it will take a lot of time. But it won't take more than a week(for one chip). 6 w* e f7 I! G9 J
0 v( v. T( e( H$ A6 X: p
For your reference. |
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