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Topic: TSV - EDA Challenges and Solutions9 B+ Q" U7 i: n% B5 M9 j
Speaker: Dr. Charles Chiang, SNPS Scientist, Synopsys 40p: }: I" L, H( j+ }$ C( r
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•Why TSV integration4 J% ?# d* b# H& p/ q7 H$ h; `
•Current trend5 j. p9 ]# j2 l. h- A
•3D IC Technology/ e( x+ X7 m8 K* X2 x3 k
•EDA challenges and solutions+ ]5 O2 H7 S# z
•Synopsys initiatives! k" O3 S3 { D8 {. h9 W% x
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