Chip123 科技應用創新平台

 找回密碼
 申請會員

QQ登錄

只需一步,快速開始

Login

用FB帳號登入

搜索
1 2 3 4
123
返回列表 發新帖
樓主: chip123
打印 上一主題 下一主題

[經驗交流] ASIC設計工程師如何保住飯碗?

  [複製鏈接]
41#
發表於 2014-6-12 10:46:55 | 只看該作者
Junior Physical Design Engineer
8 s% p" }  D( y5 t1 ?0 _
" ~7 ?, q, g9 Q9 j公      司: famous IC company
# S0 c# p$ _: V* s( {) f  O3 c& {工作地点:北京, J/ Y0 b3 ]& W* p# m1 u/ f

2 z6 ~0 v6 m% h" N; E- BPosition Tasks, Duties and Responsibilities
! q& z; u  ?+ h: {/ w, CThe ASIC Physical Design Engineer will:
% \* r$ n" i, ^* A0 |9 h        Complete third party IP integration and ensure vendor guidelines are followed. % V, w" Z2 d7 S
        Responsible for physical verification (DRC/LVS).
3 Y: C9 O/ ]3 t: q9 {) I        IO ring design, fullchip floorplan.
* k3 ~/ O. N' n4 d9 F        Block level implementation.
& D# ]6 s  T2 s7 @! V        Work with front-end engineers to resolve problems and achieve design closure. 9 |; E5 `* e, m- }5 s# _
& T2 _* B9 }$ X. C6 R( m- W
Candidate Qualifications: ! S/ M  _! ]: w3 [8 V
Candidate must: 2 t$ z8 F/ e3 @$ S( d/ `+ E' L# ~
        Hold BSEE (MS preferred).
6 F* i! N' G+ N4 H6 K1 G$ h        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification
* ^8 r/ e* k+ ^% P0 [        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC. 9 R) Y, F7 v3 f
        Have the ability to independently identify and resolve design, tool, and flow problems.
) U+ A" M+ p5 W7 k" Q- j        Have related timing and physical concept.
8 b3 J, A# p& S  ^9 j1 W        Be able to design and implement physical design strategies and methodologies for deep submicron designs.
% d6 D: X6 x1 X3 t5 g        Familiar with EDA tools. 2 M5 F0 r8 U( P; `; F. p, D
        Familiar with Linux environments.  . [4 q- s& {' R6 P5 g4 }
  u7 X9 B" {$ D+ W
Any of the following is beneficial: & L2 }9 n: K& H0 H" {* d+ B, \4 V; v
        STA constraint design
! t$ Y( c9 ?6 i% p3 s! u       Equivalence checking ?RTL to gates, and gates to gates.
回復

使用道具 舉報

42#
發表於 2014-6-19 09:41:01 | 只看該作者
Junior Physical Design Engineer
3 R0 k# q# Q( E+ _6 O) M- L5 N1 m- F7 e8 f% T3 g+ \
公      司:A famous IC company
. o1 @+ V/ x' f, l# K工作地点:北京
( ]8 z) K1 x8 |" h# g4 T
& P& d) m. `- F) x* Y' n$ UPosition Tasks, Duties and Responsibilities
/ o& @# H# P! i% o- A4 }9 i9 x; ZThe ASIC Physical Design Engineer will: ! H. y8 x5 Q* v# m  ~
        Complete third party IP integration and ensure vendor guidelines are followed.
0 m9 ~$ J- }1 L2 U1 S/ H        Responsible for physical verification (DRC/LVS).
) S& s3 b& S3 }& c+ P% u" \0 D        IO ring design, fullchip floorplan.
2 }: o! b. q  B* R/ Y# a$ b  I        Block level implementation. . M% c6 @" d: F% H( i+ }
        Work with front-end engineers to resolve problems and achieve design closure. " F3 y; ^; Z0 l1 B+ c4 A% F
4 T/ e  f& m% m
Candidate Qualifications: : p! E. ~" t% b/ m/ {8 U
Candidate must: " o0 }% Y( @  I: V7 O7 E0 e
        Hold BSEE (MS preferred).   i7 d: ~6 k- Y9 h
        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification
6 `1 I' n; ]' E4 {* @        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC.
" B. e- c8 H5 G, I, [- [        Have the ability to independently identify and resolve design, tool, and flow problems. . \" v# K' J" c. `4 e1 p7 o1 r. E! X
        Have related timing and physical concept. 1 ]# ~' n+ x$ @9 `1 O. @# D3 U' a' _
        Be able to design and implement physical design strategies and methodologies for deep submicron designs.! E; R! q3 s2 m- ~
        Familiar with EDA tools.
4 U) _1 j  l- U: X5 X) `        Familiar with Linux environments.  2 }7 P$ c6 {" X# Q; \" |
3 p$ Q; u  C2 p! b; o5 `8 s
Any of the following is beneficial:
" }) t9 y! o$ A7 R        STA constraint design / c8 Z; d& f5 C) t6 I5 z
       Equivalence checking ?RTL to gates, and gates to gates.
回復

使用道具 舉報

43#
發表於 2014-6-19 09:42:41 | 只看該作者
Sr. ASIC Design Engineer (encoder/decoder)) \# h* q2 w2 p  D
8 ]8 A  l7 \1 ]  r
公      司:a leading developer of advanced digital imaging solution
! J& q6 h' z4 E. ^$ s工作地点:上海- i# N5 u, k6 R- Z  d" o0 S9 Z
, |, M+ ^) m1 K% m
Position Overview: The candidate will join a team of  highly competent ASIC designers involved in design, verification, and implementation (ASIC) of advanced platform for XX''s future generation multi-media products.   
2 T7 n. z0 ^/ N  X! u. Z/ V( p5 c/ s% H4 v% h1 u# ]6 y0 t
主要职责 (70%) 3 x# Z0 z+ O8 ~( K: j) V
In-depth knowledge of TV encoder and decoder design. Good understanding of TV system design.  
' c7 k  z/ x/ ?Proficiency on digital filter algorithms and hardware implementation.
( u& f5 k, e: b5 KDevelopment and verification of complex IP module, integration of the IP module into the Soc devices, top-level design handling, system level testing. 4 N$ a+ _* p. ~9 |
Participate in the FPGA platform development and lab debugging   
& n7 P5 C" v1 j, T; {- S. I0 [1 I) K0 _1 n7 m) [
其他职责 (30%)
  X8 A, J* [; n' l0 x4 b( yParticipate in block level architecture design Assisting embedded FW development.7 J) F: ^! s6 X+ s. B% T! C
职位要求: O8 ~% s2 A7 ^
岗位资格 0 @; u) w' V8 B& [
经验/技能 - R3 S9 {' J! {3 c' }0 S. o( C4 B
1. Strong knowledge of TV technologies, knowledge of image signal process and CCTV system is a plus % l- @2 G5 A0 I% m
2. Strong knowledge of ASIC design flow. Can define Micro-architecture of the IP module and /or sub-blocks. And able to write detailed engineering specifications. 2 Y6 E* \- k; `4 o, H
3. Good communication skills, especially in technical writing and reporting;
- _- s6 l8 i7 p+ F; ^7 {) ^' m! d( `4. Self-motivated and ability to excel in a team environment.   
/ x* y" c8 `& U. Z- O; Y  j  R6 t* ]0 |+ w
教育
$ T+ ?6 ?! \3 {1 y7 ~MSEE/CE with 3+ years of industry experience
回復

使用道具 舉報

44#
發表於 2014-6-20 09:03:13 | 只看該作者
Senior Digital Design Engineer
3 Q: c1 O0 R9 [) L* Z6 w8 }; @# H
公      司:A leading semiconductor company$ _: z, n0 B  G! L
工作地点:香港
& f* I6 d. F* @
! ^" }9 R; x8 `( O7 ?( qJob Responsibilities: 7 X* ~4 {# U- h
    Perform logic design, RTL coding, design verification, logic synthesis, DFT and static timing analysis
3 z# z/ L8 v9 r$ ]$ s    Develop verification environment and coverage closure & k5 `0 T  x) b2 ~: H- T
    Support wafer level testing and silicon evaluation 0 h7 c! u) c+ Q
    Prepare technical documents
& w2 O' Q5 R* c3 n7 P' H4 P9 j. l5 h/ Y/ _, ]- i
Job Requirements:
3 R( @# R8 o1 a: E& v! S    B.Sc or above in Electronic Engineering or equivalent. Applicants with postgraduate degree would be considered as an advantage/ _" M$ H. f1 t' w; |
    5 Years or above of solid experience in one or more of the following areas: Verilog-based logic design and synthesis, constrained random    testbench with System Verilog & UVM, assertion based design verification or circuit-level SPICE simulations % H5 h( o" F, |6 l4 F* K' l) H
    Knowledge of SoC and embedded system. + m' e. F. B, \4 w* g8 @
    Knowledge of scripting languages such as Perl, TCL and Make
& B5 p7 x0 u4 w# h6 J    Candidate with less experience will be considered as Digital Design Engineer
回復

使用道具 舉報

45#
發表於 2014-6-24 11:57:06 | 只看該作者
Junior Physical Design Engineer
# T: L* s4 u! c. [% L; _% G( f公      司:A famous IC company
% ]9 ~  {& P- ?/ x% q6 f工作地点:北京
, ^+ b  U) z& J5 u, V6 Z  O" j6 A
Position Tasks, Duties and Responsibilities
; g9 w1 c) e, o- @The ASIC Physical Design Engineer will:
" ?. ^& }. ^2 b- Y- X        Complete third party IP integration and ensure vendor guidelines are followed.
& B+ g% j2 S  m        Responsible for physical verification (DRC/LVS). ; b9 k) e( {+ ~  f3 P* ~
        IO ring design, fullchip floorplan.
; p; E5 |0 s! f" Z' N6 P7 T9 w% V        Block level implementation. 4 q: p; l; O. j. i+ @# i6 u
        Work with front-end engineers to resolve problems and achieve design closure. , k$ J- I6 @, v# h+ Y, I6 |

. |; E( Y+ D; Z6 l* f" JCandidate Qualifications:
" k& L2 L2 l3 I7 rCandidate must: 2 ?2 m2 W  t+ @$ q5 ?7 ?
        Hold BSEE (MS preferred).
& w- ~" Q1 E, M  w        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification 4 v5 i0 D' [4 a
        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC.
: E; Y! M5 ]  {        Have the ability to independently identify and resolve design, tool, and flow problems.
: t3 j% U, S" ?        Have related timing and physical concept. ) N9 |; }6 ]9 J% U
        Be able to design and implement physical design strategies and methodologies for deep submicron designs." a1 n6 ~1 L7 S8 x! _5 a2 R
        Familiar with EDA tools.
8 h  E. i; i6 p  d        Familiar with Linux environments.  
0 M. a- p# d, q/ R4 }4 t0 b
! y! d. r8 @0 sAny of the following is beneficial:
3 n2 W3 X/ a4 P/ N0 {# o- q- B        STA constraint design 5 B9 X, d' v" h$ s& @6 n5 {* k8 D# n
       Equivalence checking ?RTL to gates, and gates to gates.
回復

使用道具 舉報

46#
發表於 2014-7-31 12:31:20 | 只看該作者
数字芯片设计工程师(DFT/综合)
& i3 i. E  Q& X$ b& c' _* ~  O, k* E
  ]& ]. o* y: Q4 ^  G0 I公      司:A mobile chipset semiconductor company
! ^' D5 m; Z# Y4 A& N9 a7 M工作地点:上海
9 y' N+ q/ p& c! b7 J1 E6 f4 R0 I7 n- u
职位描述: 8 W: ^9 ]$ I8 f9 z* k
1、To provide and support SYN&DFT work for several projects in parallel  
+ u) G9 L* C' D5 J2、Run block level implementation for each project, include synthesis, DFT and LEC * f" S3 H2 M4 k9 v" Y
3、Support block level physical evaluation  5 [! d" W3 y, J/ g
4、co-work with designer and provide block level SDC file
, _2 {" A. _2 `) w0 I/ x5、co-work with Back-end team for timing signoff
: L. Y( q+ x$ E" X, \, X% |% J
, P' u* h5 W" P$ `( @职位需求: 7 I7 z: }- V9 n7 U/ `! t2 m
1. 了解集成电路设计的基本流程
2 q" `0 T  B9 C: u2. 相关Synthesis, formal check 和DFT的工作经验。(3A, 3B, 3C精通一项即可)
2 Z, O8 Q- U! L! \% c$ M3A. 有超过2~3个项目的synthesis 经验, 用过RTL compiler且熟悉timing的相关知识  
+ k( B+ j6 p/ W( j& o: n3B. 有超过2~3个项目的formal check经验,熟悉CPF的low power flow 6 |. V: e' b  b- E) C8 l$ B
3C. 有超过2~3个项目的DFT insertion经验, 用过Mentor DFT的优先考虑
* p) k) E* R" Y9 r& M; {' N0 w5 X- a3. 具有良好的英语阅读和书写能力。
回復

使用道具 舉報

47#
發表於 2014-10-29 08:13:11 | 只看該作者

ASIC Corporation將展示節能、高頻寬效率的C-RAN解決方案

西班牙巴賽隆納--(美國商業資訊)--eASIC Corporation:# g' j3 T  u5 M8 m

0 H( v9 F/ T1 i) `0 E( s人物:
* Q7 S6 @1 j4 Q
3 G. }4 |: {" _* K領先的單光罩自適應ASIC設備供應商eASIC Corporation將由eASIC無線業務主管Christian Lanzani博士擔任代表,負責整體無線策略,包括無線存取、去程傳輸(fronthaul)連線、基頻處理和回程傳輸解決方案。 * z9 A! l( b5 y! U5 X2 C9 O5 B

; p4 p7 a6 X# a# g+ ^/ l& x% U事件:
% o$ Q1 ]' o6 W" l6 l( v* f/ g1 I* [5 u3 X) h  r8 T7 b+ j) i
eASIC將作為聯合贊助商參加Wi-Fi世界高峰會、去程傳輸暨C-RAN高峰會(Wi-Fi World Summit & Fronthaul & C-RAN Summit),展示C-RAN去程傳輸在部署方面的挑戰,提供eASIC解決方案的細節。展示過程將包括無線存取、CPRI over OTN轉換器和基頻集區,包括L1硬體加速的使用案例。, A# _$ ^  b0 o2 i5 d, {2 `" j8 C
( t) o% V  h: C4 u7 w
時間:2014年10月29日,週三 ) Y5 S8 \' ~$ ]
地點:西班牙巴賽隆納赫斯珀裡亞塔樓酒店(Hesperia Tower Hotel) * r5 I6 ?3 F$ v! G" v3 {& _  L4 S
" s; G8 c+ ?8 P/ h1 A
如需瞭解有關eASIC Corporation的更多資訊,請造訪www.easic.com。Wi-Fi世界高峰會、去程傳輸暨C-RAN高峰會細節可以從以下網址獲得:http://wifiworldsummit.com/
; t$ c/ C0 s" }
* U7 t2 M2 H& B關於eASIC
" r; h0 ~) U# Q% [# C& Y
7 E+ }- J; ~( q8 MeASIC是一家無晶圓廠半導體公司,提供突破性的單光罩自適應ASIC設備,旨在顯著降低客製化半導體設備的整體成本和縮短投產時間。使用通孔層客製路由的專利技術實現了低成本、高性能和快速周轉ASIC及單晶片系統設計。這種創新構造使eASIC能夠提供前期成本顯著低於傳統ASIC的新一代ASIC。eASIC Corporation是一家私人公司,總部位於加州聖塔克拉拉。投資人包括Khosla Ventures、Kleiner Perkins Caufield and Byers (KPCB)、Crescendo Ventures、希捷(Seagate Technology, NASDAQ:STX)和Evergreen Partners。如需eASIC的更多資訊,請造訪www.easic.com
回復

使用道具 舉報

48#
發表於 2015-2-23 20:44:05 | 只看該作者
Asic 的利基市場和 Fpga的利基市場 各有千秋.
' R/ W; _8 u$ i" r. [1 Z
回復

使用道具 舉報

49#
發表於 2015-7-23 21:32:34 | 只看該作者
回復

使用道具 舉報

您需要登錄後才可以回帖 登錄 | 申請會員

本版積分規則

首頁|手機版|Chip123 科技應用創新平台 |新契機國際商機整合股份有限公司

GMT+8, 2024-5-30 10:19 AM , Processed in 0.123516 second(s), 19 queries .

Powered by Discuz! X3.2

© 2001-2013 Comsenz Inc.

快速回復 返回頂部 返回列表