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哪種RF職務最有賺頭?

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發表於 2006-9-20 10:40:13 | 顯示全部樓層 |閱讀模式
根據 經濟部工業局通訊專業技術人才發展計畫
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RF領域之職務依產業別區分,可分為五大產業,包括:行動電話服務業、手機製造業、無線通訊網路業、全球定位系統業、及RFIC/RF模組/RF元件業,在每個產業之下細分各職務類別,RF領域共計可分為19個職務...$ a# q+ x; Q; Z$ o5 i1 z2 W
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做RF的感受!!!??? ( k7 j; R9 h3 X1 b
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遊客,如果您要查看本帖隱藏內容請回復
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發表於 2012-5-23 16:02:59 | 顯示全部樓層
招聘公司:A famous IC company
& l2 H+ S& `, l7 x2 [9 }招聘岗位:资深模拟设计工程师( \' I/ r3 j- }5 o; L
工作地点:上海,成都,南通
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  u  L4 Z2 x2 E% l岗位描述:( B0 K9 d) _+ f9 Z0 B
1. 电源产品(只要是DCDC以及PMU产品的设计,特别是大电流DCDC产品的设计)。 2. 与销售和FAE人员一起制定产品的指标。 3. 与Foundry一起沟通选择最佳工艺 4. 指导版图工程师的布图 5. 与实验室测试工程师(AE)和量产(ATE)工程师一起制定测试方案。
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1. 本科毕业,硕士和博士毕业优先考虑 2. 5-8年以上电源管理产品的独立的设计经验,具有PMU产品的设计经验优先考虑 3. 熟悉低压CMOS,BiCMOS,以及高压LDMOS等器件的物理结构和工艺制程 4. 熟练使用英文与其他国家和区域的帝奥团队沟通。
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發表於 2012-5-23 16:06:02 | 顯示全部樓層
招聘公司:A famous IC company
" o% v3 p" L. l, _3 \) B; E招聘岗位:工艺工程师- {! b/ {+ u5 U3 G( V
工作地点:Shanghai
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岗位描述:. X4 x0 j: G2 J; t, T8 y
1)作为design house与foundry沟通的桥梁,日常工作需要了解工艺合作开发的进度和配合的步骤。对正在使用的foundry工艺进行详细分析和评估,并提出建议。 2)配合IC设计解决与高压工艺密切相关的电路设计问题。 3)针对电源产品的设计需要,优化和开发集成高压器件,并对工艺菜单提出改动建议。 4)负责新工艺实验相关的MPW器件设计,流片,和性能测试评估 5)负责工艺中与ESD,latch-up等可靠性有关的保护功能评估并提出设计建议 6)公司内部关于新工艺技术的培训
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9 `8 S+ P# S' T. ^职位要求:
4 Q7 n- x' j% {) A9 p8 n$ @半导体,微电子,固体物理相关专业本科或本科以上学历 - 本科需要5年以上,硕士需要3年以上与专业有关的工作经历 - 有在半导体foundry工作的经验,有工艺过程的生产或研发经验 - 熟悉低压CMOS,BiCMOS,以及高压LDMOS等器件的物理结构和工艺制程 - 精通在电源管理常用LDMOS器件的耐压和导通阻抗的分析和关键参数调整 - 熟悉CMOS,Bibolar,和LDMOS等器件的基本参数测试和结果分析 - 熟悉器件可靠性分析和debug,包括ESD,latch-up等 - 熟悉ESD保护器件的原理和结构 - 英语技术文件
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發表於 2012-6-13 16:21:50 | 顯示全部樓層
GSA Announces Analog/Mixed-Signal/Radio Frequency Working Group Chair2 N* f4 P3 I' _4 Q9 f1 ~
SanDisk’s Dr. Abhijit Gupta to Lead Group’s Strategic Direction
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6 p$ r& Z7 j& c/ `. g6 Z2 a* VSAN JOSE, Calif. (June 12, 2012) – The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, today announced the appointment of Dr. Abhijit Gupta, director of foundry technology, SanDisk, as the Analog/Mixed-Signal/Radio Frequency (AMS/RF) Working Group Chairman.   
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' ~- K( }" {, [* {  vThe AMS/RF Working Group held its first meeting of 2012 on May 21 to plan the group’s strategic direction moving forward. The group consists of a core leadership team, with volunteers from EDA, manufacturing, and design companies.  Presentations from SanDisk and Intersil set the stage for an active brainstorming session where the group defined a need for greater interaction between design and foundry to help standardize design handoffs and explore portability within and between foundries.
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發表於 2012-6-13 16:21:58 | 顯示全部樓層
The working group, in existence for more than three years, has provided GSA membership and the semiconductor industry with several tools, including the MS/RF PDK Checklist, AMS/RF Process Checklist, MS/RF SPICE Model Checklist and the recently released Process Control Monitoring (PCM) checklist, used industry wide. The working group will continue to provide a non-competitive forum for the AMS/RF community to explore and discuss critical aspects of successful AMS and RF implementation including scaling, integration, DFM, verification, test, and power efficiencies and identify key elements that can improve efficiencies, design productivity, and profitability. , L: f. p4 H9 U
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At SanDisk, Dr. Gupta is responsible for selecting and supporting CMOS processes for SanDisk controllers. Prior to joining SanDisk in 2006, he was at Chartered Semiconductor (now GLOBALFOUNDRIES), where he was responsible for technical marketing of RFCMOS process and was an active member of many FSA (now GSA) committees. The final report from the FSA’s Reliability Committee, of which Dr. Gupta was a member, was adopted as a JEDEC (Joint Electron Device Engineering Council) standard. : h( r4 G0 f1 A5 j

& e0 \  K" k4 e' l2 @Dr. Gupta has more than 20 years’ experience in the semiconductor industry, including a variety of IDM (Integrated Device Manufacturer), fabless and foundry companies. He earned a Ph.D. in Electrical Engineering from the University of Cincinnati and a bachelor of technology degree from the Institute of Technology, Varanasi, India, in Electronics Engineering. * Q5 a3 }6 Q3 V' P8 d6 d

) p+ _" f1 B2 {5 [& P+ x) X; iFor more information on the A/MS/RF Working Group, please visit http://www.gsaglobal.org/rfams/
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發表於 2012-7-10 11:45:16 | 顯示全部樓層
招聘公司:A famous EMS company2 E" \$ F  v/ j
招聘岗位:Electronic Engineer ) L$ V) U: {9 A
工作地点:Wuxi4 x: ?6 w' Y1 [8 a
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岗位描述:
! |) C- g9 j6 S  WSUMMARY Using established procedures is responsible for design and development of new circuitry or redesign of existing circuitry to improve products. Should be able to perform circuit design unassisted from start to finish. Should be able to develop subsystem architecture at the direction of Lead Engineer or System Architect. ESSENTIAL DUTIES AND RESPONSIBILITIES include the following. Other duties may be assigned.  Work with manager and/or TPM / PM to provide information that will aid in the initial quoting process.  Provide Document Control with a complete design package consisting of schematics, BOM’s, vendor lists.  Work concurrently with ECAD, Business Unit Management, Manufacturing, Test, Purchasing, and Quality departments through the design phase of a program. Work to provide a design that not only meets the customer’s criteria, but is also of high quality, cost effective, and manufacturable.  Work with Design Manager and/or TPM / PM to provide Business Unit Management / Business Development with timely and accurate design quotations to aid in the quoting process.  Help Business Unit Management / Business Development in the decision of the feasibility and technological merit of new opportunities.  Support production discrepancies by incorporating fixes into subsequent revisions in a timely manner.  Use data collected in production in subsequent programs to ensure continuing improvement in designs.  Oversee assembly and test of engineering prototypes.  Stay abreast of the latest technology and techniques to provide designs that are competitive and cost effective.  Assigned to projects of moderate scope, where analysis of situation or data requires a review of identifiable factors.  Exercises judgment within defined procedures and practices to determine appropriate action.  Adhere to all safety and health rules and regulations associated with this position and as directed by supervisor.  Comply and follow all procedures within the company security policy. MINIMUM REQUIREMENTS  Bachelor’s degree in electronics engineering or related domains required.  Four years experience on embedded system design engineering and good in DFMEA/PFMEA.  One year working experience on mobile terminal design preferred.
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發表於 2012-7-10 11:45:27 | 顯示全部樓層
职位要求:
3 g( r4 i/ H4 ~. K' dTECHNICAL REQUIREMENTS:  Knowledge of GSM or other mobile networks architecture and protocols  Knowledge of mobile device hardware architecture  Knowledge of MCU/DSP and their application  Analog and digital circuit and telecommunication knowledge  Timing measurement (memory interfaces and data interfaces) with oscilloscope or logic analyzer  Knowledge of popular peripherals/interfaces on mobile handset – SD card, USB, UART, keypad  Making and executing of test plan and reporting  Analyze of Baseband problems + solution for problem  Knowledge of Bluetooth, Wifi  Coaching and training to factory failure analysis engineer  Build support at factory and analysis of factory measurement results  Basic knowledge of safety certification LANGUAGE SKILLS Ability to read, analyze, and interpret technical documentations. Ability to write reports, business correspondence, and procedure manuals. Ability to basically present information and respond to questions from groups of managers, clients, customers in English. REASONING ABILITY Ability to define problems, collect data, establish facts, and draw valid conclusions. Ability to interpret an extensive variety of technical instructions in mathematical or diagram form and deal with several abstract and concrete variables.
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發表於 2015-1-27 13:00:37 | 顯示全部樓層
無線通訊網路業 !!!!!!!!!!!!!!!!!!!!!!!!!
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發表於 2015-2-27 14:43:38 | 顯示全部樓層
RFIC/RF模組/RF業       
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發表於 2015-11-5 20:45:35 | 顯示全部樓層
都很有賺頭啊
: Q/ Q' q6 }( q( B未來是無線的世界
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