某半導體大廠徵求Program Manager

chip123

Title Responsibilities：

' N) K. Q& S) v8 `- a- J9 W1. Coordination among module engineering, SPICE, desgin service, reliability, marketing, , and fab on the delivery of tsmc technology.
2. Responsible for technology development, characterization, qualifaication, transfer, and early customer engagement.
9 b9 x- l6 a. z" y7 ]3. Planning, setting priority, and execution of short and long term tasks.       

Requirements：
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1. Minimum master degree in engineering field
, N  v- I) L5 H) R2. Minimum 8 years of experiences in process integration or device engineering.
3. Candidate with design or product experience is a plus
8 @! E( A) g! U8 s0 h& [! ^4. Fluent in English.
6 T  p* {* n. N& R- q, n5. Work location in Hsinchu, Taiwan."
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: v. k1 x- T' [% BPackage： around annual NT 300萬 ~700萬

Stock：providing stock option depends on experience
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意者請與 chip123@chip123.com.tw  聯絡！