某半導體大廠徵求Technical Manager

chip123

Title Responsibilities：
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1. Coordination among module engineering, SPICE, desgin service, reliability, fab, on technology development.
1 |  p2 E* \& ]+ u9 N2 M, _6 d2. Responsible for leading and mentoring an engineering team in process characterization, problem solving, yield improvement, and documenation.
3. Planning, setting priority, and exeution of short and long term tasks.       
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Requirements：
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9 q& B/ e% z) a- {- w( O' _1. Minimum master degree in engineering field
2. Minimum 5 years of experiences in process integration or device engineering.
" A) |5 z4 F5 X* p( ?9 ?# `, ~3. Candidate with design or product experience is a plus
" ~) S  p& q9 [6 v4. Fluent in English.
) S0 O+ f% X# x& B9 Q3 r4 a5. Work location in Hsinchu, Taiwan."
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Package： around annual NT 300萬 ~700萬
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  O; C* u8 M* v1 b$ F4 T& ?. [Stock： providing stock option depends on experience
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意者請與 chip123@chip123.com.tw  聯絡！