Chip123 科技應用創新平台

 找回密碼
 申請會員

QQ登錄

只需一步,快速開始

Login

用FB帳號登入

搜索
1 2 3 4
查看: 10058|回復: 1
打印 上一主題 下一主題

e-Manufacturing & DFM Symposium 4/1開放報名

  [複製鏈接]
跳轉到指定樓層
1#
發表於 2007-3-27 14:57:21 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
Keynote邀請到前清大校長劉炯朗擔任
( ]. A1 [" _  p. Fhttp://www.tsia.org.tw/seminar/eManufacturing/2007/index.htm   - q2 E; z% Z* p: n
6 u, {8 |) q, j2 z6 |

# M8 W6 }1 }# m- D$ ^$ W    This is the first e-Manufacturing symposium organized by Taiwan Semiconductor Industry Association (TSIA) aiming to forge stronger links between the Academia and the Industry on complementary and collaborative efforts in maintaining the national leading edge competitive advantages and capabililities among the world's manufacturing bases.) M, L/ N( f  h9 {( W  R4 F% |& w

8 H% p0 ]( s3 _" k0 o+ l* K- F! d  The Symposium initiates to offer a common arena for academics and professionals of business operators, concept creators, product designers, commondity manufacturers, hardware suppliers, software vendors, independent consultants, network distributors and logistics controllers to exchange fundamental concerns, to discuss immediate outlooks and future trends, and to explore the uncharted territories altogether.   s0 u" s9 Z- r8 `* `

' P3 s( U5 Z8 Z) X. U
分享到:  QQ好友和群QQ好友和群 QQ空間QQ空間 騰訊微博騰訊微博 騰訊朋友騰訊朋友
收藏收藏 分享分享 頂1 踩 分享分享
2#
發表於 2008-2-18 11:22:29 | 只看該作者

Call for Papers Announcement

e-Manufacturing & DFM Symposium 2008 (AJoint Symposium with AEC/APC-Asia Symposium 2008) hosted by TSIA will be held on November 27-28, 2008 at Ambassador Hotel HsinChu. Please submit your abstract to symposia@tsia.org.tw., l: y3 t5 `7 F# s2 @0 x
Topics of interests include, but not limited to, the following:
9 h& m1 J2 ~3 B# [" y. ?
, d) d# E- R' Z3 Rl
9 f: `6 W" s  l" ]; k; |9 v
Applications in high-volume manufacturing4 w3 ]' L. q" q5 z
l
: o  B* V2 W8 A
Automated Material Handling System
9 R* B2 K4 }2 S1 Nl& I9 D! n5 U$ ?: |+ S3 x
Benefits and justification (ROI, CoO, OEE…)
+ h4 Z* }: j+ ?l' H( H  z+ [" {7 O
Control Architecture/Engineering/IT Infrastructure7 J8 J9 N, S1 o# \7 D
l
5 D4 `  r7 F2 c, w" h. D( @
Data Collection/Quality/Storage/Management
$ K( i3 q. e' ^6 Y8 \, p5 q" @l- D9 F2 x' y3 A. k7 ?& {' D+ M5 K% u5 t
Design for Manufacturing/Testing/Yield
4 d1 t* S/ R/ w' ]. s, v( H8 `( \% Fl
( M% A( }0 h6 u1 Z& E
e-Diagnostics, e-Manufacturing, and EEC( n: b9 Z& B5 _; N8 x
l- A* A- a( v- z* |- x1 ?
Engineering/Supply/Value Chains' _6 G% u1 F& z0 l$ ]* S
l
& B5 a" x* k( ?8 r
Equipment Communication/Integration; M) }% i. T7 |& E0 \
l- o. x: q% t$ h( S4 \. O5 |
Factory Integration/Operations: H4 s$ M) {, s
l' F) Q6 Q- k# ?# \
Factory-Wide Applications and Deployment8 e& A8 F) ?$ m+ L
l
( Z& Y. M0 Z1 e4 R, u. m& C" m
Fault Detection & Classification7 X3 s8 ^( |9 ~/ K( z4 B
l* v9 p& _6 P7 h
Future APC/FDC Needs and Requirements
$ \" z2 A1 j" x  D0 R3 g' a; fl# j. D: c: A- X2 i: h
Integrated/Virtual Metrology
4 h! ^! d6 \; i; @8 |% jl6 A8 r. q7 G$ }; d8 x
Manufacturing Execution Systems
) Z( B5 L9 Y& Dl
0 _7 }5 X, a  ~( `) J$ ]
Real-Time & Defect/Yield Databases1 A& ]7 L, g8 x
l
( f+ l8 b1 O/ \$ p2 @
Piggyback and SCADA controllers0 ]! y. ?) X" V( C! E, E
l
' x7 w- ~* w" l0 a" |) J
Predictive/Preventive Maintenance3 {' c/ K. b) _/ T5 _: g/ ^
l: J: R4 \$ Q1 F; }7 n+ T% l
Process modeling and model-based control* T8 P& u9 P! B* l% U
l' b; J" i5 \3 W, j
Real-time data collection and management
9 y4 v3 T9 Z5 l8 W* Q, v7 il7 X1 U) p  a/ I9 ~' b5 K
Real-Time Decision-Making
# v& H* d/ C! `( h+ Y/ U- N, V; Dl' x* Y- s1 L8 E0 o2 S$ h9 `) w
Run-to-Run/Wafer-to-Wafer/Real-Time Control
  ~  `: d, P  J( M0 K0 w# ul* M  N5 B$ U: W$ a' o; ~
Scheduling & Dispatching
. \5 [3 e+ h% }+ q; kl4 P! [7 u1 n! b3 J
Sensor development and implementation2 Y! S" X3 Q9 W: q. w3 j! M) ^
l* t# h' q# k* Z5 v7 K3 O- @
Sensor integration into existing process tools) ]" P7 t5 Q- @8 V
l2 f+ v7 }! D- c( U; Y1 w' t2 |! n
Sensor/actuator bus and intelligent sensors
1 ]2 z; B+ T3 K$ [/ |l% W) W' V, E/ x8 T8 W; K9 r- u% L
Specification Management
" T0 z1 _% ?) |2 ql- W. {2 T9 L1 e, ~
Standards (Communication, Sensor Bus…)1 T1 J0 Y+ {3 m
l( x5 v0 `! m; e; e
Tool Productivity Data Collection/Analysis( P- \$ I' o5 U/ T& Z9 }& g
l% w. i3 V, ^# j5 `
WIP Management
! G. l! f8 X  ]/ w/ a9 h
Please consider the following important dates: ' G. l% b& ^: N. m  T% z
            Deadline of abstract submission : July 1, 20083 D+ N  r6 G5 Z, `
            Notification of accetpance : August 22, 2008, \1 c: X- z- w+ I8 a' q9 w
            Final paper due : October 20, 2008# Z6 R3 n% C5 I0 D6 P5 Q. y
            Deadline of early registration : October 20, 2008
! K0 Y! b" l, R/ X. C4 `0 g7 H, D" ?& f$ |8 i. N  n
If any question, please contact with Celia Shih  石英堂
4 m. N# t+ |0 N+ w3 ~Taiwan Semiconductor Industry Association* B2 `' J, d6 i* v7 f. ?- g0 W
台灣半導體產業協會3 N: ?( {+ _' Q% S& t' j3 S
Tel : +886-3-5917092$ `5 {4 I5 ~6 G& H  D% b
Fax: +886-3-5820056
您需要登錄後才可以回帖 登錄 | 申請會員

本版積分規則

首頁|手機版|Chip123 科技應用創新平台 |新契機國際商機整合股份有限公司

GMT+8, 2024-4-27 08:23 AM , Processed in 0.105006 second(s), 17 queries .

Powered by Discuz! X3.2

© 2001-2013 Comsenz Inc.

快速回復 返回頂部 返回列表