如題: 4 ^* b- w. g7 D' `2 M# h: h! B" Y各位大大們: 9 Z7 y. c0 ]/ X請教一下 Number of bonded IOBs: 563 out of 440 127% (*) 7 b0 Q! V, a- m3 t0 g* K* a
我的IOB超出範圍出現以下錯誤..該如何解決啊??$ `( H) d6 S0 `. b
8 i2 }8 N) H' A+ v! b9 M
ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device. : W% u5 O; s& o5 D9 I; d" F4 F: B# I* u$ x2 ?
ERROR:Map:115 - The design is too large to fit the device. Please check the% E* M9 }& z7 s1 f z
Design Summary section to see which resource requirement for your design) \. ]; e. q, E( C
exceeds the resources available in the device. In particular check the ' Q6 p! ?" M" ^& r non-slice resources since the slice counts may reflect the early termination# H* l- k% l3 f, Q. e
of the flow.9 j e W: h9 e% N0 g! k
* P. @' m, |. d, I! p! O NOTE: An NCD file will still be generated to allow you to examine the mapped" j2 v0 W. k% u) O- c% m+ C6 D Y0 w
design. This file is intended for evaluation use only, and will not process. b) P2 d+ r( a' o
successfully through PAR. 5 V7 G- S6 O, @: E1 P1 f, U1 ?7 }& [. |
ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device. 7 h0 D: o7 R9 k4 N& S ' L6 j, O% V; J8 Q5 V4 m謝謝
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發表於 2007-8-9 11:25:02
如題:
ack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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