ISE的問題...請教前輩們

mclaren_18

   如題:
/ V$ V, W* j$ o9 _! @1 X- t# c各位大大們:
請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
我的IOB超出範圍出現以下錯誤..該如何解決啊??
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ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

5 B! V% v# s; k2 ^$ @ERROR:Map:115 - The design is too large to fit the device.  Please check the
! {2 L. e3 R' J0 Y   Design Summary section to see which resource requirement for your design
  g# _( D. d/ H& B6 ?   exceeds the resources available in the device.  In particular check the
$ }$ e& R2 p! n3 V   non-slice resources since the slice counts may reflect the early termination
   of the flow.
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5 l6 [/ q6 N8 w  }+ W) c   NOTE:  An NCD file will still be generated to allow you to examine the mapped
   design.  This file is intended for evaluation use only, and will not process
( T8 Z1 j# y( @   successfully through PAR.

" l& y3 z# z# ?' mERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
換較大的 package or 減少 IO 使用數量!