ISE的問題...請教前輩們

mclaren_18

   如題:
% o% t1 U9 O5 l2 ]9 }' g0 W各位大大們:
' {: p9 h% T1 C請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
5 \& ?( m1 w9 `3 G我的IOB超出範圍出現以下錯誤..該如何解決啊??
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( v. [6 n7 p) q0 g/ D" w2 N( dERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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8 p) I4 |1 p2 p, V& Q/ O% CERROR:Map:115 - The design is too large to fit the device.  Please check the
   Design Summary section to see which resource requirement for your design
9 k: ]3 |" P, b- t/ J   exceeds the resources available in the device.  In particular check the
   non-slice resources since the slice counts may reflect the early termination
   of the flow.

   NOTE:  An NCD file will still be generated to allow you to examine the mapped
   design.  This file is intended for evaluation use only, and will not process
   successfully through PAR.
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8 E: g+ ^2 d- O2 VERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
0 d- G7 g8 i7 _換較大的 package or 減少 IO 使用數量!