如題: ( D9 W4 T* b4 U \1 M$ B5 n/ t( Y" `各位大大們: : Z7 g7 o2 w1 r: m! r請教一下 Number of bonded IOBs: 563 out of 440 127% (*) . Z, i. ]. u7 `# X7 e# E我的IOB超出範圍出現以下錯誤..該如何解決啊??8 @" ]( P" H$ ^: u# R% i0 m
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ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device. ; P# Q6 V9 J( y- o: H- y ' ~; c5 R2 ?5 g6 M9 C- RERROR:Map:115 - The design is too large to fit the device. Please check the 4 n: k. ^; Z( H j R: C* O Design Summary section to see which resource requirement for your design , ^7 c7 ]( Z$ g2 X/ f exceeds the resources available in the device. In particular check the % A1 u4 O& A4 R: R+ d0 s0 e' K non-slice resources since the slice counts may reflect the early termination & z' I' U/ }) ]3 e of the flow.8 Y& ^9 I8 r' D: }
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NOTE: An NCD file will still be generated to allow you to examine the mapped / \9 W9 q3 S7 K% _& f; V( b design. This file is intended for evaluation use only, and will not process- u& {3 m) l1 _) _! g
successfully through PAR.. {3 f/ ^( i7 }- T3 A7 }4 v( e
5 _% K9 z2 Z" Y! y1 A) u% rERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.+ R2 ^$ w. Y1 \$ @, J
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