ISE的問題...請教前輩們

mclaren_18

   如題:
% a) `1 [  y( y6 s, S各位大大們:
1 f0 N. ?. T5 V7 Q2 W0 t請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
" a: v7 s$ z9 L1 B- s我的IOB超出範圍出現以下錯誤..該如何解決啊??
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ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

ERROR:Map:115 - The design is too large to fit the device.  Please check the
0 S# E5 O( R6 T% c2 d; J/ M   Design Summary section to see which resource requirement for your design
/ L( W7 Q+ Y; T- `" ]/ ~4 n, r6 I7 Z   exceeds the resources available in the device.  In particular check the
   non-slice resources since the slice counts may reflect the early termination
" K  W$ s9 _. D& e   of the flow.

6 z. J9 q0 f  R   NOTE:  An NCD file will still be generated to allow you to examine the mapped
   design.  This file is intended for evaluation use only, and will not process
& }* R4 ^# S  o2 x) Q& j   successfully through PAR.
1 q7 Q% r/ ?1 p7 a
7 a2 {. z5 B- NERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

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