thanks wesleysungisme for your answer. W; i' }4 k$ O6 M; R
as our pin count is over 1000 and no. of power is ~ 20, so it's quite time-consuming. I) n; b( a" s- R( n' c! q2 Kand there is technical issue about bonding all the dies into COB for ESD zapping, i wonder if anyone could share their practise? we feel difficult to strictly follow JEDEC standard.