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Product Yield Manager
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, c- |: O. D( h/ ~公 司:a leading developer of advanced digital imaging solution# d* p4 ?" S# v7 l9 K9 ]8 Y
工作地点:上海
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Responsibilities: & a3 k f3 ^1 `* }- | O) R
1.Lead a cross function teams of OSC PE/OOC PIE/NPI/US PE for Yield Improvement.
' Z2 m0 H8 t* _5 {2.Coordinate and manage engineering activities across OSC,OOC,TW NPI and US PE team to develop and implement continuous improvement programs in yield, quality, manufacture capacity and other operation issues. ' i6 I6 w' J+ U8 M$ d0 `
3.Analyze the failure breakdown and dispose of problematic lot or material.
5 c% q1 `7 E; h5 l( H# c4.Support CQE/FAE to perform failure analysis on customer return samples and provide corrective actions to prevent quality issue reoccurred.
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Requirements: # _, @- p& D4 q5 ?2 N
1.Bachelor or above degree with MicroElectronics, Material & Science or Electronic Engineering related majors.
2 T, h$ @9 @6 @2.5 years+ related experience on wafer fabrication process integration/yield improvement or Assemble process integration/yield improvement
! [7 Y; q7 j# L) O' B. O1 ~8 H; d3.Strong communication and stakeholder management 3 q6 P- h$ A- ^* C
3.Good team leader and professional technical knowledge. 9 b9 \4 |+ X$ a. k( ]& Y1 m; E
4.Excellent analysis and problem solve skills. , C2 [& w$ T9 j( u/ X
5.Excellent oral and written English. ! h4 @9 [% q2 H" D% |2 t8 O
6.Optical knowledge/experience will be plus |
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